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CORC

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Ultrasonic effects in the thermosonic flip chip bonding process 期刊论文
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 卷号: 3, 期号: 2, 页码: 336-341
作者:  Wang, Fuliang*;  Han, Lei
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
Experimental study of thermosonic gold bump flip-chip bonding with a smooth end tool 期刊论文
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 卷号: 3, 期号: 6, 页码: 930-934
作者:  Wang, Fuliang*;  Han, Lei
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
Effects of ultrasonic power and time on bonding strength and interfacial atomic diffusion during thermosonic flip-chip bonding 期刊论文
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 卷号: 2, 期号: 3, 页码: 521-526
作者:  Li, Junhui;  Zhang, Xiaolong;  Liu, Linggang;  Deng, Luhua;  Han, Lei
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/03
Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface 期刊论文
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 卷号: 1, 期号: 6, 页码: 852-858
作者:  Wang, Fuliang*;  Chen, Yun;  Han, Lei
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/03
Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding 期刊论文
IEEE Transactions on Components and Packaging Technologies, 2009, 卷号: 32, 期号: 2, 页码: 261-267
作者:  Zhili Long;  Yunxin Wu;  Lei Han;  Jue Zhong
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
Stress-induced atom diffusion at thermosonic flip chip bonding interface 期刊论文
Sensors and Actuators, A: Physical, 2009, 卷号: 149, 期号: 1, 页码: 100-105
作者:  Wang, Fuliang*;  Han, Lei;  Zhong, Jue
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/03
Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding 会议论文
2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26
作者:  Kun, Zhao[1];  Jianhua, Zhang[2];  Ji'an, Duan[3]
收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10
Mechanical properties of arrayed Pb-free tin bump and its interfacial reaction with Ni-PUBM during reflow process 期刊论文
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, 页码: 51-54
Zhu, DP; Le, L
收藏  |  浏览/下载：13/0  |  提交时间：2012/03/24
Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding 会议论文
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings
作者:  Zhao, Kun[1];  Zhang, Jianhua[2];  Duan, Ji'an[3]
收藏  |  浏览/下载：11/0  |  提交时间：2019/05/10
Effects of thermosonic bonding parameters on flip chip LEDs 会议论文
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006-06-27
作者:  Zhao, Kun[1];  Jia, Lei[2];  Duan, Ji'an[3];  Zhang, Jianhua[4]
收藏  |  浏览/下载：7/0  |  提交时间：2019/05/10

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