QQ客服 官方微博 反馈留言

	Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
	Wang, Fuliang*; Chen, Yun; Han, Lei
刊名	IEEE Transactions on Components, Packaging and Manufacturing Technology
	2011
卷号	1期号:6页码:852-858
关键词	Bonding process laser doppler vibrometer thermosonic flip-chip bonding ultrasonic vibration vibration measurement
ISSN号	2156-3950
DOI	10.1109/TCPMT.2011.2138703
URL标识	查看原文
WOS记录号	WOS:000292829100005;EI:20121614956344
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3320570
专题	中南大学
作者单位	1.[Han, Lei 2.Wang, Fuliang 3.Chen, Yun] Cent S Univ, Sch Mech & Elect Engn, Changsha 410083, Peoples R China.
推荐引用方式 GB/T 7714	Wang, Fuliang*,Chen, Yun,Han, Lei. Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2011,1(6):852-858.
APA	Wang, Fuliang*,Chen, Yun,&Han, Lei.(2011).Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface.IEEE Transactions on Components, Packaging and Manufacturing Technology,1(6),852-858.
MLA	Wang, Fuliang*,et al."Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface".IEEE Transactions on Components, Packaging and Manufacturing Technology 1.6(2011):852-858.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。