Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding | |
Kun, Zhao[1]; Jianhua, Zhang[2]; Ji'an, Duan[3] | |
2007 | |
会议名称 | 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06 |
会议日期 | 2006-08-26 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2384761 |
专题 | 上海大学 |
作者单位 | [1]Key Laboratory of Advanced Display and System Application, Ministry of Education, No. 149 Yanchang Rd., Shanghai, China |School of Mechatronics Engineering and Automation, Shanghai University, No. 149 Yanchang Rd., Shanghai, China [2]Key Laboratory of Advanced Display and System Application, Ministry of Education, No. 149 Yanchang Rd., Shanghai, China |School of Mechatronics Engineering and Automation, Shanghai University, No. 149 Yanchang Rd., Shanghai, China [3]Central South University, Changsha, China |
推荐引用方式 GB/T 7714 | Kun, Zhao[1],Jianhua, Zhang[2],Ji'an, Duan[3]. Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding[C]. 见:2006 7th International Conference on Electronics Packaging Technology, ICEPT '06. 2006-08-26. |
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