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Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding
Kun, Zhao[1]; Jianhua, Zhang[2]; Ji'an, Duan[3]
2007
会议名称2006 7th International Conference on Electronics Packaging Technology, ICEPT '06
会议日期2006-08-26
URL标识查看原文
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/2384761
专题上海大学
作者单位[1]Key Laboratory of Advanced Display and System Application, Ministry of Education, No. 149 Yanchang Rd., Shanghai, China |School of Mechatronics Engineering and Automation, Shanghai University, No. 149 Yanchang Rd., Shanghai, China [2]Key Laboratory of Advanced Display and System Application, Ministry of Education, No. 149 Yanchang Rd., Shanghai, China |School of Mechatronics Engineering and Automation, Shanghai University, No. 149 Yanchang Rd., Shanghai, China [3]Central South University, Changsha, China
推荐引用方式
GB/T 7714
Kun, Zhao[1],Jianhua, Zhang[2],Ji'an, Duan[3]. Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding[C]. 见:2006 7th International Conference on Electronics Packaging Technology, ICEPT '06. 2006-08-26.
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