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	Effects of ultrasonic power and time on bonding strength and interfacial atomic diffusion during thermosonic flip-chip bonding
	Li, Junhui; Zhang, Xiaolong; Liu, Linggang; Deng, Luhua; Han, Lei
刊名	IEEE Transactions on Components, Packaging and Manufacturing Technology
	2012
卷号	2期号:3页码:521-526
关键词	Atomic diffusion bonding strength thermosonic flip-chip ultrasonic power
ISSN号	2156-3950
DOI	10.1109/TCPMT.2012.2183601
URL标识	查看原文
WOS记录号	WOS:000301237100019;EI:20121414912158
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3347692
专题	中南大学
作者单位	[Li, Junhui] Cent S Univ, Sch Mech & Elect Engn, Changsha 410083, Hunan, Peoples R China.
推荐引用方式 GB/T 7714	Li, Junhui,Zhang, Xiaolong,Liu, Linggang,et al. Effects of ultrasonic power and time on bonding strength and interfacial atomic diffusion during thermosonic flip-chip bonding[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2012,2(3):521-526.
APA	Li, Junhui,Zhang, Xiaolong,Liu, Linggang,Deng, Luhua,&Han, Lei.(2012).Effects of ultrasonic power and time on bonding strength and interfacial atomic diffusion during thermosonic flip-chip bonding.IEEE Transactions on Components, Packaging and Manufacturing Technology,2(3),521-526.
MLA	Li, Junhui,et al."Effects of ultrasonic power and time on bonding strength and interfacial atomic diffusion during thermosonic flip-chip bonding".IEEE Transactions on Components, Packaging and Manufacturing Technology 2.3(2012):521-526.

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