| Effects of thermosonic bonding parameters on flip chip LEDs | |
| Zhao, Kun[1]; Jia, Lei[2]; Duan, Ji'an[3]; Zhang, Jianhua[4] | |
| 2006 | |
| 会议名称 | 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings |
| 会议日期 | 2006-06-27 |
| 页码 | 297-303 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2391884 |
| 专题 | 上海大学 |
| 作者单位 | 1.School of Mechatronics Engineering and Automation, Shanghai University, Yanchang Rd., Shanghai, China 2.Shanghai Jiaotong University, Shanghai, China 3.Central South University, Changsha, China |
| 推荐引用方式 GB/T 7714 | Zhao, Kun[1],Jia, Lei[2],Duan, Ji'an[3],et al. Effects of thermosonic bonding parameters on flip chip LEDs[C]. 见:2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings. 2006-06-27. |
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