| Experimental study of thermosonic gold bump flip-chip bonding with a smooth end tool | |
| Wang, Fuliang*; Han, Lei | |
| 刊名 | IEEE Transactions on Components, Packaging and Manufacturing Technology
 |
| 2013 | |
| 卷号 | 3期号:6页码:930-934 |
| 关键词 | Bonding parameters bonding strength gold bump on silver pad smooth end tool thermosonic flip-chip (TSFC) bonding ultrasonic vibration |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2013.2257926 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000319682600005;EI:20132416413156 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3338349 |
| 专题 | 中南大学 |
| 作者单位 | 1.[Han, Lei 2.Wang, Fuliang] State Key Lab High Performance Complex Mfg, Changsha 410083, Hunan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Fuliang*,Han, Lei. Experimental study of thermosonic gold bump flip-chip bonding with a smooth end tool[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology,2013,3(6):930-934. |
| APA | Wang, Fuliang*,&Han, Lei.(2013).Experimental study of thermosonic gold bump flip-chip bonding with a smooth end tool.IEEE Transactions on Components, Packaging and Manufacturing Technology,3(6),930-934. |
| MLA | Wang, Fuliang*,et al."Experimental study of thermosonic gold bump flip-chip bonding with a smooth end tool".IEEE Transactions on Components, Packaging and Manufacturing Technology 3.6(2013):930-934. |
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