| Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding | |
| Zhao, Kun[1]; Zhang, Jianhua[2]; Duan, Ji'an[3] | |
| 2006 | |
| 会议名称 | ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings |
| 页码 | 851-855 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2391828 |
| 专题 | 上海大学 |
| 作者单位 | 1.Shanghai Univ, Key Lab Adv Display & Syst Appl, Minist Educ, Shanghai, Peoples R China. 2.Shanghai Univ, Key Lab Adv Display & Syst Appl, Minist Educ, 149 Yanchang Rd, Shanghai, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhao, Kun[1],Zhang, Jianhua[2],Duan, Ji'an[3]. Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding[C]. 见:ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings. |
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