| Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding | |
| Zhili Long; Yunxin Wu; Lei Han; Jue Zhong | |
| 刊名 | IEEE Transactions on Components and Packaging Technologies
 |
| 2009 | |
| 卷号 | 32期号:2页码:261-267 |
| 关键词 | Dynamical properties finite element method (FEM) analysis thermosonic flip chip bonding ultrasonic transducer |
| ISSN号 | 1521-3331 |
| DOI | 10.1109/TCAPT.2009.2017380 |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000268282800005;EI:20093312255919 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3341456 |
| 专题 | 中南大学 |
| 作者单位 | 1.[Jue Zhong 2.Yunxin Wu 3.Lei Han 4.Zhili Long] Cent S Univ, Dept Mechatron, Changsha 410083, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhili Long,Yunxin Wu,Lei Han,et al. Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding[J]. IEEE Transactions on Components and Packaging Technologies,2009,32(2):261-267. |
| APA | Zhili Long,Yunxin Wu,Lei Han,&Jue Zhong.(2009).Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding.IEEE Transactions on Components and Packaging Technologies,32(2),261-267. |
| MLA | Zhili Long,et al."Dynamics of Ultrasonic Transducer System for Thermosonic Flip Chip Bonding".IEEE Transactions on Components and Packaging Technologies 32.2(2009):261-267. |
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