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科研机构
上海大学 [27]
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期刊论文 [15]
会议论文 [12]
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AIBA as Free Radical Initiator for Abrasive-Free Polishing of Hard Disk Substrate
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2015, 卷号: 44, 页码: 1245-1252
作者:
Lei, Hong[1]
;
Ren, Xiaoyan[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/26
Abrasive-free polishing
hard disk substrate
material removal rate
initiator
AIBA
Effect of Mn (II) ion on abrasive-free polishing of hard disk substrate
会议论文
4th International Conference on Frontiers of Manufacturing Science and Measuring Technology, ICFMM 2014, 2014-06-19
作者:
Fang, Liang[1]
;
Lei, Hong[2]
;
Zhao, Rong[3]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/30
Preparation of porous alumina-g-polystyrene sulfonic acid abrasive and its chemical mechanical polishing behavior on hard disk substrate
期刊论文
MICROELECTRONIC ENGINEERING, 2014, 卷号: 116, 页码: 11-16
作者:
Huang, Liqin[1]
;
Wang, Zhijun[2]
;
Lei, Hong[3]
;
Chen, Ruling[4]
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/04/30
Chemical mechanical polishing (CMP)
Porous alumina-g-polystyrene sulfonic acid abrasive
Hard disk substrate
Planarization
Effect of Benzoyl Peroxide/N, N-Dimethyl aniline initiating system on material removal rate in abrasive-free polishing of hard disk substrate
会议论文
International Conference on Planarization CMP Technology (ICPT)
作者:
Jiang, Ting[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/30
Influence of Zn (II) ion on abrasive-free polishing of hard disk substrate
期刊论文
THIN SOLID FILMS, 2014, 卷号: 562, 页码: 377-382
作者:
Lei, Hong[1]
;
Zhao, Rong[2]
;
Chen, Ruling[3]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
Abrasive-free polishing
Hard disk substrate
Zinc (II) Ion
Material removal rate
Tribochemistry
Effect of AIBA on Abrasive-free Polishing of Hard Disk Substrate with Peroxyacetic Acid System Slurry
会议论文
Design, Manufacturing and Mechatronics, 2014-03-21
作者:
Ren, Xiao-yan[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/04/30
AIBA
peroxyacetic acid
abrasive-free polishing (AFP)
Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2014, 卷号: 43, 页码: 4186-4192
作者:
Jiang, Ting[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/30
Abrasive-free chemical polishing
cumene hydroperoxide (CHP)
initiator
material removal rate
mechanism
Abrasive-free Chemical Polishing of Hard Disk Substrate with Benzoyl Peroxide-H2O2 Slurry
会议论文
Design, Manufacturing and Mechatronics, 2014-03-21
作者:
Jiang, Ting[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/30
benzoyl peroxide (BPO)
initiator
material removal rate (MRR)
Effect of Cu (II) ion on abrasive-free polishing of hard disk substrate with peroxyacetic acid system slurry
会议论文
MATERIALS PROCESSING AND MANUFACTURING III, PTS 1-4, 2013-05-11
作者:
Wang, Zhijun[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/30
Cu (II) ion
peroxyacetic acid
abrasive-free polishing (AFP)
Abrasive-free polishing of hard disk substrate with H2O2-K2S2O8-NaHSO3 slurry
会议论文
MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013-03-30
作者:
Zhang, Weitao[1]
;
Lei, Hong[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/30
Abrasive-free polishing (AFP)
hard disk substrate
material removal rate (MRR)
initiator
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