Effect of Cu (II) ion on abrasive-free polishing of hard disk substrate with peroxyacetic acid system slurry | |
Wang, Zhijun[1]; Lei, Hong[2] | |
2013 | |
会议名称 | MATERIALS PROCESSING AND MANUFACTURING III, PTS 1-4 |
会议日期 | 2013-05-11 |
关键词 | Cu (II) ion peroxyacetic acid abrasive-free polishing (AFP) |
页码 | 333-336 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2290373 |
专题 | 上海大学 |
作者单位 | 1.[1]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. 2.[2]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. |
推荐引用方式 GB/T 7714 | Wang, Zhijun[1],Lei, Hong[2]. Effect of Cu (II) ion on abrasive-free polishing of hard disk substrate with peroxyacetic acid system slurry[C]. 见:MATERIALS PROCESSING AND MANUFACTURING III, PTS 1-4. 2013-05-11. |
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