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	Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry
	Jiang, Ting[1]; Lei, Hong[2]
刊名	JOURNAL OF ELECTRONIC MATERIALS
	2014
卷号	43页码:4186-4192
关键词	Abrasive-free chemical polishing cumene hydroperoxide (CHP) initiator material removal rate mechanism
ISSN号	0361-5235
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2281019
专题	上海大学
作者单位	1.[1]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China. 2.[2]Shanghai Univ, Res Ctr Nanosci & Nanotechnol, Shanghai 200444, Peoples R China.
推荐引用方式 GB/T 7714	Jiang, Ting[1],Lei, Hong[2]. Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry[J]. JOURNAL OF ELECTRONIC MATERIALS,2014,43:4186-4192.
APA	Jiang, Ting[1],&Lei, Hong[2].(2014).Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry.JOURNAL OF ELECTRONIC MATERIALS,43,4186-4192.
MLA	Jiang, Ting[1],et al."Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry".JOURNAL OF ELECTRONIC MATERIALS 43(2014):4186-4192.

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