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浏览/检索结果: 共20条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369 作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng 收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02 Chip scale packages  Copper  Copper alloys  Flip chip devices  Grain boundaries  Growth rate  Size determination  Soldered joints  Substrates  Tin alloys, Electronic product  Grain boundary motions  Interface reactions  Lateral growth rates  Longitudinal growth  Packaging process  Packaging technologies  Solder composition, Soldering   48 48 pixelated addressable full-color micro display based on flip-chip micro LEDs 期刊论文 Applied Optics, 2019, 卷号: 58, 期号: 31, 页码: 8383-8389 作者:  Y.Li;  J.Tao;  Y.Zhao;  J.Wang;  J.Lv 收藏  |  浏览/下载：3/0  |  提交时间：2020/08/24 Light emitting diodes,Color,Etching,Flip chip devices,Pixels,Substrates   Photoelectric Characteristics of Micro Flip-Chip AlGaInP Light Emitting Diode Array 期刊论文 Guangxue Xuebao/Acta Optica Sinica, 2018, 卷号: 38, 期号: 9 作者:  Ban, Zhang;  Liang, Jingqiu;  Lu, Jinguang;  Li, Yang 收藏  |  浏览/下载：2/0  |  提交时间：2019/09/17 Flip chip devices  Aluminum alloys  Copper  Diodes  Energy utilization  Gallium alloys  Heat convection  Heat resistance  III-V semiconductors  Indium alloys  Light emitting diodes  Microchannels  Numerical methods  Optical devices  Photoelectricity  Polydimethylsiloxane  Semiconductor alloys  Silicones  Temperature   High-luminous efficacy white light-emitting diodes with thin-film flip-chip technology and surface roughening scheme (EI收录) 期刊论文 Journal of Physics D: Applied Physics, 2016, 卷号: 49 作者:  Hu, Xiao-Long[1,2];  Zhang, Jing[1,2];  Wang, Hong[1,2];  Zhang, Xi-Chun[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Diodes  Efficiency  Etching  Flip chip devices  Gallium nitride  Inductively coupled plasma  Light emission  Lighting  Phosphors  Silicones  Thin films   Performance of InGaN-based thin-film LEDs with flip-chip configuration and concavely patterned surface fabricated on electroplating metallic substrate (EI收录) 期刊论文 IEEE Photonics Journal, 2016, 卷号: 8 作者:  Hu, Xiao-Long[1];  Qi, Zhao-Yi[1];  Wang, Hong[1];  Zhang, Xi-Chun[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Electrodes  Electroplating  Fabrication  Flip chip devices  Gallium nitride  Light emitting diodes  Sapphire  Substrates   Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录) 期刊论文 Journal of Materials Science: Materials in Electronics, 2012, 卷号: 23, 页码: 1543-1551 作者:  Zhou, M.B.[1];  Ma, X.[1];  Zhang, X.P.[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 Differential scanning calorimetry  Flip chip devices  Interface states  Intermetallics  Liquids  Phase interfaces  Soldering alloys  Tin   Development of reworkable underfill materials for flip chip 期刊论文 2010, 2010 Yu Kun; Liang Tongxiang; Guo Wenli 收藏  |  浏览/下载：5/0 Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Reliability analysis and case studies on FCBGA packaged devices (EI收录) 会议 Changsha, China, 作者:  Lin, Xiao-Ling[1];  Xie, Shao-Feng[1];  Yao, Ruo-He[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Chip scale packages  Cracks  Electronics packaging  Failure (mechanical)  Failure analysis  Field programmable gate arrays (FPGA)  Flip chip devices  Integrated circuit interconnects  Packaging  Reconfigurable hardware  Reliability  Soldered joints  Soldering  Soldering alloys  Thermal stress   A study of flip-chip direct attachment LED COBs with metal core print circuit boards (EI收录) 会议论文 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, Beijing, China, November 10, 2013 - November 12, 2013 作者:  Li, Cheng[1];  Li, Honghao[1];  Li, Zongtao[1,2];  Ding, Xinrui[1,2];  Guan, Wohuan[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Flip chip devices  Leakage currents  Lighting  Reconfigurable hardware  Stresses