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	Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
	Huang, Jia-Qiang[1,2]; Zhou, Min-Bo[1]; Li, Wang-Yun[1,2]; Zhang, Xin-Ping[1,2]
关键词	Ball grid arrays Electronics packaging Flip chip devices Isotherms Lead free solders Microstructural evolution Microstructure Size determination Soldered joints Soldering Soldering alloys Surface chemistry
会议地点	Wuhan, China
URL标识	查看原文
内容类型	会议
URI标识	http://www.corc.org.cn/handle/1471x/2039444
专题	华南理工大学
推荐引用方式 GB/T 7714	Huang, Jia-Qiang[1,2],Zhou, Min-Bo[1],Li, Wang-Yun[1,2],等.Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录).

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