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	Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录)
	Zhou, M.B.[1]; Ma, X.[1]; Zhang, X.P.[1,2]
刊名	Journal of Materials Science: Materials in Electronics
	2012
卷号	23页码:1543-1551
关键词	Differential scanning calorimetry Flip chip devices Interface states Intermetallics Liquids Phase interfaces Soldering alloys Tin
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2247122
专题	华南理工大学
作者单位	1.[1] School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China 2.[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
推荐引用方式 GB/T 7714	Zhou, M.B.[1],Ma, X.[1],Zhang, X.P.[1,2]. Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录)[J]. Journal of Materials Science: Materials in Electronics,2012,23:1543-1551.
APA	Zhou, M.B.[1],Ma, X.[1],&Zhang, X.P.[1,2].(2012).Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录).Journal of Materials Science: Materials in Electronics,23,1543-1551.
MLA	Zhou, M.B.[1],et al."Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录)".Journal of Materials Science: Materials in Electronics 23(2012):1543-1551.

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