Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录) | |
Zhou, M.B.[1]; Ma, X.[1]; Zhang, X.P.[1,2] | |
刊名 | Journal of Materials Science: Materials in Electronics
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2012 | |
卷号 | 23页码:1543-1551 |
关键词 | Differential scanning calorimetry Flip chip devices Interface states Intermetallics Liquids Phase interfaces Soldering alloys Tin |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2247122 |
专题 | 华南理工大学 |
作者单位 | 1.[1] School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China 2.[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China |
推荐引用方式 GB/T 7714 | Zhou, M.B.[1],Ma, X.[1],Zhang, X.P.[1,2]. Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录)[J]. Journal of Materials Science: Materials in Electronics,2012,23:1543-1551. |
APA | Zhou, M.B.[1],Ma, X.[1],&Zhang, X.P.[1,2].(2012).Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录).Journal of Materials Science: Materials in Electronics,23,1543-1551. |
MLA | Zhou, M.B.[1],et al."Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录)".Journal of Materials Science: Materials in Electronics 23(2012):1543-1551. |
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