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	A study of flip-chip direct attachment LED COBs with metal core print circuit boards (EI收录)
	Li, Cheng[1]; Li, Honghao[1]; Li, Zongtao[1,2]; Ding, Xinrui[1,2]; Guan, Wohuan[1,2]
会议名称	2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013
会议日期	November 10, 2013 - November 12, 2013
会议地点	Beijing, China
关键词	Flip chip devices Leakage currents Lighting Reconfigurable hardware Stresses
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2050662
专题	华南理工大学
作者单位	1.[1] Foshan NationStar Optoelectronics Co., Ltd., Foshan 2.Guangdong, China 3.[2] Key Laboratory of Surface Functional Structure Manufacturing of Guangdong High Education Institutes, South China University of Technology, Guangdong, China
推荐引用方式 GB/T 7714	Li, Cheng[1],Li, Honghao[1],Li, Zongtao[1,2],等. A study of flip-chip direct attachment LED COBs with metal core print circuit boards (EI收录)[C]. 见:2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013. Beijing, China. November 10, 2013 - November 12, 2013.

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