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CORC

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Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析] 期刊论文
Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University, 2019, 卷号: 46, 页码: 54-60
作者:  Zhao, F.;  Qiu, Y.;  Jia, F.;  Ma, H.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30
Calibration method of projection coordinate system for X-ray cone-beam laminography scanning system 期刊论文
NDT & E INTERNATIONAL, 2012, 卷号: 52, 期号: 0, 页码: 16-22
作者:  Yang, Min;  Zhang, Jianhai;  Yuan, Maodan;  Li, Xingdong;  Liu, Wenli
收藏  |  浏览/下载：21/0  |  提交时间：2013/10/11
Study on thermal shock resistance of insulated metal substrate 期刊论文
2010, 2010
Guo Liquan; Liu Yang; Ma Jusheng
收藏  |  浏览/下载：3/0
Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections 期刊论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, 页码: 111-116
Xu, GW; Wu, YH; Geng, F; Huang, QP; Zhou, J; Luo, L
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24
DESIGN  BGA  
相变存储器单元阵列的自动化演示系统 期刊论文
微计算机信息, 2007, 期号: 20
梁爽; 宋志棠; 刘波; 封松林
收藏  |  浏览/下载：18/0  |  提交时间：2012/01/06
Apparatus and method for integrating an optical transceiver with a surface mount package 专利
专利号: US6592269, 申请日期: 2003-07-15, 公开日期: 2003-07-15
作者:  BROPHY, BRENOR L.;  LIE, JAMES H.;  WRIGHT, ANDREW J.
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/24
16-channel 0.35 mu m CMOS/VCSEL optoelectronic devices 会议论文
asia-pacific optical and wireless communications conference (apoc 2001), beijing, peoples r china, nov 12-15, 2001
Chen HD; Mao LH; Jun T; Kun L; Yun D; Huang YZ; Wu RH; Jun F; Ke XM; Liu HY; Wang Z
收藏  |  浏览/下载：13/0  |  提交时间：2010/10/29
Hybrid CMOS/VCSEL optoelectronic modules 会议论文
6th international conference on solid-state and integrated-circuit technology, shanghai, peoples r china, oct 22-25, 2001
Chen HD; Mao LH; Tiang J; Liang K; Du Y; Huang YZ; Wu RG; Feng J; Ke XM; Liu HY; Wang ZG; Li SR; Li ZY; Guo WL
收藏  |  浏览/下载：15/0  |  提交时间：2010/10/29
VCSEL based optoelectronic multiple chip modules 会议论文
conference on optical interconnects for telecommunication and data communications, beijing, peoples r china, nov 08-10, 2000
Chen HD; Liang K; Du Y; Huang YZ; Tiang J; Ma XY; Wu RH; Li SY; Guo WL; Xu GJ; Wang Y
收藏  |  浏览/下载：10/0  |  提交时间：2010/10/29
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议
Wuhan, China,
作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11

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