Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections

	Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections
	Xu, GW ; Wu, YH ; Geng, F ; Huang, QP ; Zhou, J ; Luo, L
刊名	2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2
	2008
页码	111-116
关键词	DESIGN BGA
通讯作者	Xu, GW, Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, Shanghai 200050, Peoples R China
学科主题	Engineering, Electrical & Electronic; Engineering, Mechanical
收录类别	SCI
语种	英语
公开日期	2012-03-24
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/95023]
专题	上海微系统与信息技术研究所_功能材料与器件_期刊论文
推荐引用方式 GB/T 7714	Xu, GW,Wu, YH,Geng, F,et al. Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections[J]. 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2,2008:111-116.
APA	Xu, GW,Wu, YH,Geng, F,Huang, QP,Zhou, J,&Luo, L.(2008).Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections.2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2,111-116.
MLA	Xu, GW,et al."Development of Three-dimensional Multichip Module Based on Embedded Substrate with Multiple Interconnections".2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2 (2008):111-116.