VCSEL based optoelectronic multiple chip modules
Chen HD ; Liang K ; Du Y ; Huang YZ ; Tiang J ; Ma XY ; Wu RH ; Li SY ; Guo WL ; Xu GJ ; Wang Y
2000
会议名称conference on optical interconnects for telecommunication and data communications
会议日期nov 08-10, 2000
会议地点beijing, peoples r china
关键词VCSEL photodetector CMOS MCM optoelectronic integration optical interconnects SURFACE-EMITTING LASERS MQW MODULATORS INTEGRATION CIRCUITS VLSI
页码112-115
通讯作者chen hd chinese acad sci inst semicond state key lab integrated optoelect beijing 100083 peoples r china.
中文摘要we report on optoelectronic multiple chip modules, consisting of vertical cavity surface emitting laser(vcsel), photodetector and 1.2 mum cmos electronic circuit, the hybrid integrated components operate at a date rate of 155mb/s, which could be used in optical interconnects for multiple computers.
英文摘要we report on optoelectronic multiple chip modules, consisting of vertical cavity surface emitting laser(vcsel), photodetector and 1.2 mum cmos electronic circuit, the hybrid integrated components operate at a date rate of 155mb/s, which could be used in optical interconnects for multiple computers.; 于2010-10-29批量导入; made available in dspace on 2010-10-29t06:36:52z (gmt). no. of bitstreams: 1 2889.pdf: 132449 bytes, checksum: 848bb0f3f1baab34b47f430cc52a13da (md5) previous issue date: 2000; china opt & optoelectr manufacturers assoc.; chinese phys soc.; spie.; chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china
收录类别CPCI-S
会议主办者china opt & optoelectr manufacturers assoc.; chinese phys soc.; spie.
会议录optical interconnects for telecommunication and data communications, 4225
会议录出版者spie-int soc optical engineering ; 1000 20th st, po box 10, bellingham, wa 98227-0010 usa
会议录出版地1000 20th st, po box 10, bellingham, wa 98227-0010 usa
学科主题光电子学
语种英语
ISSN号0277-786x
ISBN号0-8194-3896-0
内容类型会议论文
源URL[http://ir.semi.ac.cn/handle/172111/13721]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Chen HD,Liang K,Du Y,et al. VCSEL based optoelectronic multiple chip modules[C]. 见:conference on optical interconnects for telecommunication and data communications. beijing, peoples r china. nov 08-10, 2000.
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