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| Wideband noise isolation of planar EBG with embedded capacitors and inductors 会议论文 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者: Li Baoxia; Zhang Jing; Cui Zhiyong; Du Tianmin; Wang Haidong 收藏  |  浏览/下载:17/0  |  提交时间:2015/08/27 |
| An Experimental Verified Model for Cu Electrodeposition Simulation for the Filling of High Aspect Ratio Through Silicon Vias 会议论文 IEEE 63rd Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2013-05-28 作者: Wu, Heng; Tang, Zhen-an; Wang, Zhu; Cheng, Wan; Song, Chongsheng 收藏  |  浏览/下载:3/0  |  提交时间:2019/12/11 |
| Numerical Simulation and Experimental Verification of Copper Plating with Different Additives for Through Silicon Vias 会议论文 4th Electronic System-Integration Technology Conference (ESTC), Amsterdam, NETHERLANDS, 2012-09-17 作者: Song, Chongshen; Wu, Heng; Jing, Xiangmeng; Dai, Fengwei; Yu, Daquan 收藏  |  浏览/下载:3/0  |  提交时间:2019/12/18 |
| Synthesis and Characterization of ZnO Nanowires by Solvothermal Method and Fabrication of Nanowire-based ZnO Nanofilms 会议论文 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012-08-13 作者: Chu, Yanbiao[1]; Wan, Lixi[2]; Wang, Xiehuan[3]; Zhang, Jingwei[4] 收藏  |  浏览/下载:7/0  |  提交时间:2019/12/23 |
| Dielectric enhancement of BaTiO 3/BaSrTiO 3/SrTiO 3 multilayer thin films deposited on Pt/Ti/SiO 2/Si substrates by sol–gel method 期刊论文 Materials Letters, 2011, 卷号: 65, 期号: 23, 页码: 3574-3576 作者: Zhao ning; Wan lixi; Cao liqiang; Yu daquan; Yu shuhui 收藏  |  浏览/下载:14/0  |  提交时间:2015/08/25 |
| Properties of ferroelectric thin film capacitor for embedded passive applications 会议论文 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China 作者: Ning Zhao; Lixi Wan; Shuhui Yu 收藏  |  浏览/下载:15/0  |  提交时间:2015/08/25 |
| Electromagnetic Interference Suppression and Simultaneous Switching Noise Mitigation in System on Package Using a Lowpass Filter Structure with Embedded Capacitor 会议论文 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Shanghai 作者: Lei Li; Yunfeng Wang; Lixi Wan; Xiaoli Liu; Rong Sun 收藏  |  浏览/下载:12/0  |  提交时间:2015/08/21 |
| Design of Miniaturized Bandpass Filters for GSM and GPS Applications Using Embedded Capacitor Material 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 作者: Yunfeng Wang; Lei Li; Lixi Wan 收藏  |  浏览/下载:10/0  |  提交时间:2015/08/21 |
| Miniaturized printed wire antenna in package for 2.4GHz wireless communications 会议论文 2009 International Conference on ElectronicPackaging Technology and High Density Packaging, ICEPT-HDP 2009 作者: Xiaoli Liu; Yunfeng Wang; Lei Li; Lixi Wan 收藏  |  浏览/下载:12/0  |  提交时间:2015/08/21 |
| Absorption of Ag3Sn on Cu6Sn5 Intermetallic Compounds at Sn-3.5Ag-xCu/Cu Interfaces 会议论文 International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-08-10 作者: Zhao, Ning; Wang, Lai; Wan, Lixi; Cao, Liqiang 收藏  |  浏览/下载:3/0  |  提交时间:2019/12/24 |