| Numerical Simulation and Experimental Verification of Copper Plating with Different Additives for Through Silicon Vias | |
| Song, Chongshen; Wu, Heng; Jing, Xiangmeng; Dai, Fengwei; Yu, Daquan; Wan, Lixi | |
| 2012 | |
| 会议名称 | 4th Electronic System-Integration Technology Conference (ESTC) |
| 会议日期 | 2012-09-17 |
| 会议地点 | Amsterdam, NETHERLANDS |
| 页码 | - |
| 会议录 | 4th Electronic System-Integration Technology Conference (ESTC)
 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4804427 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China. 2.Dalian Univ Technol, Dalian 116024, Peoples R China. 3.Jiangsu R&D Ctr Internet Things, Wuxi, Jiangsu 214315, Peoples R China. 4.Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China. 5.Jiangsu R&D Ctr Internet Things, Wuxi, Jiangsu 214315, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Song, Chongshen,Wu, Heng,Jing, Xiangmeng,et al. Numerical Simulation and Experimental Verification of Copper Plating with Different Additives for Through Silicon Vias[C]. 见:4th Electronic System-Integration Technology Conference (ESTC). Amsterdam, NETHERLANDS. 2012-09-17. |
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