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	Wideband noise isolation of planar EBG with embedded capacitors and inductors
	Li Baoxia; Zhang Jing; Cui Zhiyong; Du Tianmin; Wang Haidong; Wan Lixi; Sun Rong; Yu Shuhui; Luo Suibin
	2013
会议名称	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
会议地点	Dalian, China
英文摘要	This paper presents three related planar EBG (electromagnetic bandgap) structures based on embedded capacitors and inductors, which have small-footprints and can be used in package power or ground planes to provide wideband isolation among different parts of the power distribution network (PDN). Measurement shows -40dBisolation from 2-2.5GHz to over 10GHz. In order to improve performance at lower frequencies we explore the synthesis of planar EBG structures and Chip CeramicCapacitors or Ferrite Beads.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/4581]
专题	深圳先进技术研究院_集成所
作者单位	2013
推荐引用方式 GB/T 7714	Li Baoxia,Zhang Jing,Cui Zhiyong,et al. Wideband noise isolation of planar EBG with embedded capacitors and inductors[C]. 见:2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013. Dalian, China.

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