| Absorption of Ag3Sn on Cu6Sn5 Intermetallic Compounds at Sn-3.5Ag-xCu/Cu Interfaces | |
| Zhao, Ning; Wang, Lai; Wan, Lixi; Cao, Liqiang | |
| 2009 | |
| 会议名称 | International Conference on Electronic Packaging Technology & High Density Packaging |
| 会议日期 | 2009-08-10 |
| 会议地点 | Beijing, PEOPLES R CHINA |
| 页码 | 829-+ |
| 会议录 | International Conference on Electronic Packaging Technology & High Density Packaging
 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5324061 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, 2 Linggong Rd, Dalian 116024, Peoples R China. 2.Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China. 3.Dalian Univ Technol, Sch Mat Sci & Engn, 2 Linggong Rd, Dalian 116024, Peoples R China. 4.Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhao, Ning,Wang, Lai,Wan, Lixi,et al. Absorption of Ag3Sn on Cu6Sn5 Intermetallic Compounds at Sn-3.5Ag-xCu/Cu Interfaces[C]. 见:International Conference on Electronic Packaging Technology & High Density Packaging. Beijing, PEOPLES R CHINA. 2009-08-10. |
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