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浏览/检索结果: 共15条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Wideband noise isolation of planar EBG with embedded capacitors and inductors 会议论文 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者:  Li Baoxia;  Zhang Jing;  Cui Zhiyong;  Du Tianmin;  Wang Haidong 收藏  |  浏览/下载：15/0  |  提交时间：2015/08/27 An Experimental Verified Model for Cu Electrodeposition Simulation for the Filling of High Aspect Ratio Through Silicon Vias 会议论文 IEEE 63rd Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2013-05-28 作者:  Wu, Heng;  Tang, Zhen-an;  Wang, Zhu;  Cheng, Wan;  Song, Chongsheng 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Numerical Simulation and Experimental Verification of Copper Plating with Different Additives for Through Silicon Vias 会议论文 4th Electronic System-Integration Technology Conference (ESTC), Amsterdam, NETHERLANDS, 2012-09-17 作者:  Song, Chongshen;  Wu, Heng;  Jing, Xiangmeng;  Dai, Fengwei;  Yu, Daquan 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/18 Synthesis and Characterization of ZnO Nanowires by Solvothermal Method and Fabrication of Nanowire-based ZnO Nanofilms 会议论文 13th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012-08-13 作者:  Chu, Yanbiao[1];  Wan, Lixi[2];  Wang, Xiehuan[3];  Zhang, Jingwei[4] 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/23 Dielectric enhancement of BaTiO 3/BaSrTiO 3/SrTiO 3 multilayer thin films deposited on Pt/Ti/SiO 2/Si substrates by sol–gel method 期刊论文 Materials Letters, 2011, 卷号: 65, 期号: 23, 页码: 3574-3576 作者:  Zhao ning;  Wan lixi;  Cao liqiang;  Yu daquan;  Yu shuhui 收藏  |  浏览/下载：14/0  |  提交时间：2015/08/25 Properties of ferroelectric thin film capacitor for embedded passive applications 会议论文 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China 作者:  Ning Zhao;  Lixi Wan;  Shuhui Yu 收藏  |  浏览/下载：15/0  |  提交时间：2015/08/25 Electromagnetic Interference Suppression and Simultaneous Switching Noise Mitigation in System on Package Using a Lowpass Filter Structure with Embedded Capacitor 会议论文 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Shanghai 作者:  Lei Li;  Yunfeng Wang;  Lixi Wan;  Xiaoli Liu;  Rong Sun 收藏  |  浏览/下载：12/0  |  提交时间：2015/08/21 Design of Miniaturized Bandpass Filters for GSM and GPS Applications Using Embedded Capacitor Material 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 作者:  Yunfeng Wang;  Lei Li;  Lixi Wan 收藏  |  浏览/下载：10/0  |  提交时间：2015/08/21 Miniaturized printed wire antenna in package for 2.4GHz wireless communications 会议论文 2009 International Conference on ElectronicPackaging Technology and High Density Packaging, ICEPT-HDP 2009 作者:  Xiaoli Liu;  Yunfeng Wang;  Lei Li;  Lixi Wan 收藏  |  浏览/下载：12/0  |  提交时间：2015/08/21 Absorption of Ag3Sn on Cu6Sn5 Intermetallic Compounds at Sn-3.5Ag-xCu/Cu Interfaces 会议论文 International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-08-10 作者:  Zhao, Ning;  Wang, Lai;  Wan, Lixi;  Cao, Liqiang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/24