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浏览/检索结果: 共10条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375 作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Brittle fracture  Copper alloys  Ductile fracture  Fracture  Intermetallics  Lead  free solders  Manganese  Nanoparticles  Scanning electron microscopy  Silver  Silver alloys  Soldered joints  Soldering alloys  Strain rate  Tensile properties  Tensile testing  Tin  Tin alloys   Effect of Nano-TiO2particles on growth of interfacial Cu6Sn5and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2solder joints (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2016, 卷号: 684, 页码: 299-309 作者:  Tang, Y.[1];  Luo, S.M.[1];  Wang, K.Q.[1];  Li, G.Y.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Activation energy  Chemical activation  Copper compounds  Diffusion  Energy dispersive spectroscopy  Grain boundaries  Grain growth  Intermetallics  Lead  free solders  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Titanium dioxide  X ray diffraction  X ray spectroscopy   Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录) 会议论文 11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005 作者:  Zhang, X.P.[1,2];  Shi, Y.W.[3];  Mai, Y.W.[1];  Shrestha, S.[4];  Dorn, L.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Creep  Creep resistance  Fractography  Fracture  Fracture mechanics  Lead  Microelectronics  Nanocomposites  Particle reinforced composites  Silver  Silver alloys  Soldering alloys  Textures   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints (EI收录) 会议 Wuhan, China, 作者:  Wen, Qiang[1,2];  Li, Xunping[2];  Li, Guoyuan[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Electronics packaging  Lead  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Soldered joints  Thermal fatigue   Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Chengdu, China, August 12, 2014 - August 15, 2014 作者:  Tang, Y.[1,2];  Zhou, B.[3];  Huang, J.H.[1];  Wu, Z.Z.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/12 Bismuth compounds  Copper compounds  Electronics packaging  Grain boundaries  Intermetallics  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Silver  Soldered joints  Tin   Abnormal Grain Growth in Cu6Sn5 Grains Formed at Sn-based Solder/Cu Interfaces (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Yang, Ming[1];  Li, Mingyu[1];  Wu, Jianxin[2];  Xu, Jinhua[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 lead-free solders  abnormal growth  diffusion  IMC   Undercooling Behavior and Solidification Microstructure Evolution of Sn-Cu-Ni Solders Modified by Minute Amount of Mixed Rare Earth La-Ce (CPCI-S收录) 会议论文 PRICM 7, PTS 1-3 作者:  Zhou, Minbo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Sn-Cu-Ni alloy  lead-free solder  mixed rare earth La-Ce  undercooling  microstructure evolution   Current induced interfacial microstructure and strength weakening of SAC/FeNi-Cu connection (EI收录) 会议论文 Applied Mechanics and Materials, Huhhot, China, July 26, 2014 - July 27, 2014 作者:  Wang, Xiao Jing[1];  Li, Tian Yang[1];  Chen, Yun Xia[2];  Wang, Jian Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Ductile fracture  Electrodes  Electromigration  Grain boundaries  Intermetallics  Lead  free solders  Microstructure  Shear flow