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Microstructure evolution and wear mechanism of in situ prepared Ti–TiN cermet layers at high temperature
期刊论文
Composites Part B: Engineering, 2022, 卷号: 242
作者:
Cheng, Qianqian
;
Zhang, Penglin
;
Ma, Xiaoguang
;
Wan, Shanhong
;
Jialin chen
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2022/07/20
Cermets
Friction
Microstructure
Stacking faults
Strain hardening
Titanium alloys
Titanium nitride
Wear resistance
Composite cermets
Evolution mechanism
Highest temperature
Laser melting
Microstructure evolutions
Microstructure wear
Modified layer
Titanium (alloys)
Wear mechanisms
Wear scars
Compositional interpretation of high elasticity Cu–Ni–Sn alloys using cluster-plus-glue-atom model
期刊论文
Journal of Materials Research and Technology, 2022, 卷号: 17, 页码: 1246-1258
作者:
Yang, M.
;
Hu, Y.L.
;
Li, X.N.
;
Li, Z.M.
;
Zheng, Y.H.
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2022/04/21
Aluminum alloys
Atoms
Cobalt alloys
Copper alloys
Glues
Precipitation (chemical)
Solid solutions
Spinodal decomposition
Tin alloys
Zinc alloys
Atomic ratio
Cluster-plus-glue-atom model
Cu-Ni-Sn alloy
Decomposition structures
Discontinuous precipitation
Glue atoms
matrix
Precipitated phase
Segregation
Solution content
A simultaneous enhancement of both strength and ductility by a novel differential-thermal ECAP process in Mg-Sn-Zn-Zr alloy
期刊论文
Journal of Alloys and Compounds, 2022, 卷号: 889
作者:
Zhou, Tianshui
;
Zhang, Quanfa
;
Li, Qianqian
;
Wang, Lidong
;
Li, Qinglin
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2022/02/17
Ductility
Formability
Grain boundaries
Grain refinement
Grain size and shape
Magnesium alloys
Textures
Tin alloys
Zinc alloys
Zircaloy
Channel angular pressing
Differential thermals
Differential-thermal equal-channel angular pressing
ECAP processing
Equal channel angular
Mechanical
Prismatic
slip
Property
Strength and ductilities
Zr alloys
Wetting of substoichiometric YSZ2-x by molten Sn-based active alloys at 800–900 °C
期刊论文
Ceramics International, 2022, 卷号: 48, 期号: 20, 页码: 30621-30629
作者:
Sui, Ran
;
Tan, Kaihui
;
Lin, Qiaoli
;
Xie, Kaibin
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Activation analysis
Activation energy
Binary alloys
Bond strength (chemical)
Brazing
Diffusion bonding
Phase interfaces
Tin alloys
Yttria stabilized zirconia
Yttrium oxide
Zircaloy
Dissolutive wetting
Interface formation
Liquid/solid interface
Metallicities
Modified sessile drop method
Non-metallic
Soldering
Titania
Yttria-stabilized
Zirconia substrates
Microstructure and tribological behaviors of diffusion bonded powder sintered Cu–Sn based alloys
期刊论文
Materials Research Express, 2021, 期号: 8, 页码: 116505
作者:
Li Zhenyu
;
Zhao Gengrui
;
Wang Honggang
;
Gao Gui
;
Chen Shengsheng
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2021/11/22
Cu alloy
diffusion alloyed powder
friction and wear
third-body layer
Microstructure and tribological behaviors of diffusion bonded powder sintered Cu-Sn based alloys
期刊论文
MATERIALS RESEARCH EXPRESS, 2021, 卷号: 8, 期号: 11
作者:
Li, Zhenyu
;
Zhao, Gengrui
;
Wang, Honggang
;
Gao, Gui
;
Chen, Shengsheng
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/12/17
Cu alloy
diffusion alloyed powder
friction and wear
third-body layer
Influence of microstructure on the fatigue crack growth behavior of a near-alpha TWIP Ti alloy
期刊论文
Materials Characterization, 2021, 卷号: 178
作者:
Wang, Qi
;
Ren, Junqiang
;
Zhang, Binbin
;
Xin, Chao
;
Wu, Yukun
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Aluminum alloys
Cracks
Deformation
Fatigue of materials
Lamellar structures
Molybdenum alloys
Plasticity
Tin alloys
Titanium alloys
Twinning
Bi-modal structures
Deformation twin
Equiaxed structures
Fatigue crack growth behavior
Fatigue cracks
Fatigue cracks propagation
High resistance
Ti alloys
Ti-5111
Twin inducing plasticity
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:
Qiu, Hongyu
;
Xu, Han
;
Zhang, Chuge
;
Hu, Xiaowu
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2022/02/17
Binary alloys
Copper alloys
Electromigration
Tensile strength
Tin alloys
Bonding joints
Co content
Coaddition
Current direction
Electric density
Micro-structure evolutions
Solder joints
Wetting of SiC by molten Cu–20Me–2Cr (Me=Ag, Mn, Si, and Sn) alloys at 1373 K
期刊论文
Vacuum, 2021, 卷号: 185
作者:
Lin, Qiaoli
;
Liu, Lu
;
Yang, Hongyu
;
Li, Liumeng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2021/03/02
Dissolution
Manganese
Silicon carbide
Silver
Tin alloys
Cr addition
Critical concentration
Interfacial structures
Precipitation reaction
Reaction layers
Si addition
Spreading dynamics
Generalized stacking fault energies and critical resolved shear stresses of random alpha-Ti-Al alloys from first-principles calculations
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 850, 页码: 11
作者:
Yu, Hui
;
Cao, Shuo
;
Youssef, Sabry S.
;
Ma, Ying-Jie
;
Lei, Jia-Feng
收藏
  |  
浏览/下载:49/0
  |  
提交时间:2021/02/02
Generalized stacking fault energy
Critical resolved shear stress
Titanium alloy
First-principles calculations
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