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浏览/检索结果: 共11条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序作者升序作者降序提交时间升序提交时间降序题名升序题名降序 AIBA as Free Radical Initiator for Abrasive-Free Polishing of Hard Disk Substrate 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2015, 卷号: 44, 页码: 1245-1252 作者:  Lei, Hong[1];  Ren, Xiaoyan[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 Abrasive-free polishing  hard disk substrate  material removal rate  initiator  AIBA   Influence of Zn (II) ion on abrasive-free polishing of hard disk substrate 期刊论文 THIN SOLID FILMS, 2014, 卷号: 562, 页码: 377-382 作者:  Lei, Hong[1];  Zhao, Rong[2];  Chen, Ruling[3] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Abrasive-free polishing  Hard disk substrate  Zinc (II) Ion  Material removal rate  Tribochemistry   Effect of AIBA on Abrasive-free Polishing of Hard Disk Substrate with Peroxyacetic Acid System Slurry 会议论文 Design, Manufacturing and Mechatronics, 2014-03-21 作者:  Ren, Xiao-yan[1];  Lei, Hong[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30 AIBA  peroxyacetic acid  abrasive-free polishing (AFP)   Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2014, 卷号: 43, 页码: 4186-4192 作者:  Jiang, Ting[1];  Lei, Hong[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Abrasive-free chemical polishing  cumene hydroperoxide (CHP)  initiator  material removal rate  mechanism   Effect of Cu (II) ion on abrasive-free polishing of hard disk substrate with peroxyacetic acid system slurry 会议论文 MATERIALS PROCESSING AND MANUFACTURING III, PTS 1-4, 2013-05-11 作者:  Wang, Zhijun[1];  Lei, Hong[2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 Cu (II) ion  peroxyacetic acid  abrasive-free polishing (AFP)   Abrasive-free polishing of hard disk substrate with H2O2-K2S2O8-NaHSO3 slurry 会议论文 MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013-03-30 作者:  Zhang, Weitao[1];  Lei, Hong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Abrasive-free polishing (AFP)  hard disk substrate  material removal rate (MRR)  initiator   Effect of K2S2O8 on material removal rate in abrasive-free polishing of hard disk substrate 会议论文 MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013-03-30 作者:  Zhao, Rong[1];  Lei, Hong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 abrasive-free polishing  hard disk substrate  material removal rate  K2S2O8 initiator   Abrasive-free polishing of hard disk substrate with H2O2-C4H10O2-Na2S2O5 slurry 期刊论文 FRICTION, 2013, 卷号: 1, 页码: 359-366 作者:  Zhang, Weitao[1];  Lei, Hong[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 abrasive-free polishing  material removal rate  initiator  hard disk substrate   Cu (II) as a catalyst for hydrogen peroxide system abrasive-free polishing on hard disk substrate 会议论文 MICRO-NANO TECHNOLOGY XIV, PTS 1-4, 2012-11-04 作者:  Wang, Zhijun[1];  Lei, Hong[2];  Zhang, Weitao[3];  Zhao, Rong[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Cu (II)  catalyst  abrasive-free polishing (AFP)  MRR   Effect of pH on hard disk substrate polishing in glycine-hydrogen peroxide system abrasive-free slurry 会议论文 MICRO-NANO TECHNOLOGY XIV, PTS 1-4, 2012-11-04 作者:  Chen Sisi[1];  Lei Hong[2];  Chen Ruling[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 abrasive free polishing (AFP)  glycine  hydrogen peroxide  hard disk substrate