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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 428-437
作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/15
Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7
作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15
Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology 期刊论文
Journal of Alloys and Compounds, 2019, 卷号: 781
作者:  Liu, Shengfa;  Zhang, Dongxiao;  Xiong, Jieran;  Chen, Chen;  Song, Tianjie
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
Effect of In addition on the properties of Sn-Au-Cu lead-free solder 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yin, Siqi;  Huang, Mingliang;  Chen, Yu
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 degrees C 期刊论文
Materials Science and Engineering A, 2016, 卷号: 651, 页码: 626-635
作者:  Liu, Wensheng;  Wang, Yikai;  Ma, Yunzhu*;  Yu, Qiang;  Huang, Yufeng
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/03
Microstructure and mechanical properties of Sn-rich Au-Sn solders designed using cluster-plus-glue-atom model 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 卷号: 664, 页码: 221-226
作者:  Huang, M. L.;  Yang, Y. C.;  Chen, Y.;  Dong, C.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions of Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Chen, Y.;  Huang, M. L.;  Zhao, N.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Huang ML(黄明亮);  Zhao N(赵宁)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09

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