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	Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 degrees C
	Liu, Wensheng; Wang, Yikai; Ma, Yunzhu*; Yu, Qiang; Huang, Yufeng
刊名	Materials Science and Engineering A
	2016
卷号	651页码:626-635
关键词	Interfacial microstructure Shear fracture Au-20Sn Multiple reflows Isothermal aging
ISSN号	0921-5093
DOI	10.1016/j.msea.2015.11.025
URL标识	查看原文
WOS记录号	WOS:000367486800074;EI:20154701565013
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3334308
专题	中南大学
作者单位	1.[Huang, Yufeng 2.Ma, Yunzhu 3.Yu, Qiang 4.Liu, Wensheng 5.Wang, Yikai] Cent S Univ, State Key Lab Powder Met, Changsha 410083, Hunan, Peoples R China.
推荐引用方式 GB/T 7714	Liu, Wensheng,Wang, Yikai,Ma, Yunzhu*,et al. Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 degrees C[J]. Materials Science and Engineering A,2016,651:626-635.
APA	Liu, Wensheng,Wang, Yikai,Ma, Yunzhu*,Yu, Qiang,&Huang, Yufeng.(2016).Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 degrees C.Materials Science and Engineering A,651,626-635.
MLA	Liu, Wensheng,et al."Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 degrees C".Materials Science and Engineering A 651(2016):626-635.

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