Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates | |
Huang ML(黄明亮); Zhao N(赵宁) | |
2016 | |
会议名称 | 17th International Conference on Electronic Packaging Technology Wuhan |
页码 | 534-537 |
会议录 | 17th International Conference on Electronic Packaging Technology Wuhan
![]() |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4378801 |
专题 | 大连理工大学 |
推荐引用方式 GB/T 7714 | Huang ML,Zhao N. Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates[C]. 见:17th International Conference on Electronic Packaging Technology Wuhan. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论