Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate

doi:10.1088/2053-1591/ab155f

CORC > 兰州理工大学 > 兰州理工大学 > 省部共建有色金属先进加工与再利用国家重点实验室

	Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate
	Bao, Nifa 1; Hu, Xiaowu 1; Li, Qinglin 2
刊名	MATERIALS RESEARCH EXPRESS
	2019-07
卷号	6 期号:7
关键词	Sn37Pb/Kovar system TEM growth kinetics interfacial reaction intermetallic compounds
ISSN号	2053-1591
DOI	10.1088/2053-1591/ab155f
英文摘要	The interfacial reactions and microstructural evolution of Sn37Pb/Kovar with Au/Ni platings solder joints were investigated during isothermal aging at 120 degrees C, 150 degrees C and 170 degrees C for different duration, respectively. The experimental results indicated that a thin interfacial intermetallic compounds (IMCs) layer formed at the Sn37Pb/Kovar interface after reflowing process. The accurate compositions of thin IMCs were double-layers of (Ni, Au)(3)Sn-4 and AuSn4, which were confirmed by utilizing TEM-EDS analysis. However, during the aging process, the compositions of interfacial IMCs of solder joint obviously changed, which transformed from AuSn4/(Ni,Au)(3)Sn-4 to (Au, Ni)Sn-4/Ni3Sn4 and the AuSn4 IMC formed in the bulk solder gradually changed to the (Au, Ni)Sn-4 IMC. Furthermore, the total IMC thickness increased dramatically with increasing isothermal aging time, as well as aging temperature. The growth process of IMC layer is mainly dominated by the volume diffusion mechanism during the solid-state aging. The square of growth rate constant (K) equals to 2.559 x 10(-17), 1.307 x 10(-16) and 7.781 x 10(-16) m(2) s(-1) for the aging temperature of 120 degrees C, 150 degrees C and 170 degrees C, respectively. The activation energy (Q) value of the Sn37Pb/Kovar couple was calculated to be approximate 95.96 kJ.mol(-1).
资助项目	Natural Science Foundation of Jiangxi Province[20161BAB206122]
WOS研究方向	Materials Science
语种	英语
出版者	IOP PUBLISHING LTD
WOS记录号	WOS:000464508200001
状态	已发表
内容类型	期刊论文
源URL	[http://119.78.100.223/handle/2XXMBERH/31762]
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
通讯作者	Hu, Xiaowu
作者单位	1.Nanchang Univ, Mech & Elect Engn Sch, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式 GB/T 7714	Bao, Nifa,Hu, Xiaowu,Li, Qinglin. Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate[J]. MATERIALS RESEARCH EXPRESS,2019,6(7).
APA	Bao, Nifa,Hu, Xiaowu,&Li, Qinglin.(2019).Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate.MATERIALS RESEARCH EXPRESS,6(7).
MLA	Bao, Nifa,et al."Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate".MATERIALS RESEARCH EXPRESS 6.7(2019).