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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Spacelike developable surfaces through a common line of curvature in Minkowski 3-space (CPCI-S收录EI收录) 会议 作者:  Li, Cai-Yun[1];  Zhu, Chun-Gang[2];  Wang, Ren-Hong[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Spacelike developable surface  Line of curvature  Frenet frame   Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 micro-scale solder joint  creep deformation  current density  electro-thermo-mechanical coupled loads   Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 micro-scale solder joint  size effect  creep deformation  creep mechanism  fracture behavior   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Impact of Folic-acid Intervention and MTHFRC677T Gene Polymorphism on All-cause Mortality Associated with Elevated Serum Homocysteine Levels (CPCI-S收录) 会议 作者:  Xu, Benjamin[1];  Kong, Xiangyi[2];  Xu, Richard[1];  Zhao, Min[3];  Song, Yun[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Serum homocysteine  all-cause mortality  folic acid  MTHFR C677T polymorphism   Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Cu/Sn-3.0Ag-0.5Cu/Cu solder joint  creep behavior  DC current stressing  fracture mode  joint thickness