QQ客服 官方微博 反馈留言

浏览/检索结果: 共15条，第1-10条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Friction and Wear of Ti3SiC2-Ag/Inconel 718 Tribo-Pair Under a Hemisphere-on-Disk Contact 会议论文 第八届先进陶瓷国际研讨会, 中国重庆, 2013-11-4～2013-11-7 作者:  Hai WX(海万秀);  Lv JJ(吕晋军);  Meng JH(孟军虎) 收藏  |  浏览/下载：36/0  |  提交时间：2014/12/26 friction  wear  Ti3SiC2  Ag  Inconel 718   Effect of Mn (II) ion on abrasive-free polishing of hard disk substrate 会议论文 4th International Conference on Frontiers of Manufacturing Science and Measuring Technology, ICFMM 2014, 2014-06-19 作者:  Fang, Liang[1];  Lei, Hong[2];  Zhao, Rong[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 Effect of Benzoyl Peroxide/N, N-Dimethyl aniline initiating system on material removal rate in abrasive-free polishing of hard disk substrate 会议论文 International Conference on Planarization CMP Technology (ICPT) 作者:  Jiang, Ting[1];  Lei, Hong[2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/30 Effect of AIBA on Abrasive-free Polishing of Hard Disk Substrate with Peroxyacetic Acid System Slurry 会议论文 Design, Manufacturing and Mechatronics, 2014-03-21 作者:  Ren, Xiao-yan[1];  Lei, Hong[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30 AIBA  peroxyacetic acid  abrasive-free polishing (AFP)   Abrasive-free Chemical Polishing of Hard Disk Substrate with Benzoyl Peroxide-H2O2 Slurry 会议论文 Design, Manufacturing and Mechatronics, 2014-03-21 作者:  Jiang, Ting[1];  Lei, Hong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 benzoyl peroxide (BPO)  initiator  material removal rate (MRR)   Effect of Cu (II) ion on abrasive-free polishing of hard disk substrate with peroxyacetic acid system slurry 会议论文 MATERIALS PROCESSING AND MANUFACTURING III, PTS 1-4, 2013-05-11 作者:  Wang, Zhijun[1];  Lei, Hong[2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 Cu (II) ion  peroxyacetic acid  abrasive-free polishing (AFP)   Abrasive-free polishing of hard disk substrate with H2O2-K2S2O8-NaHSO3 slurry 会议论文 MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013-03-30 作者:  Zhang, Weitao[1];  Lei, Hong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Abrasive-free polishing (AFP)  hard disk substrate  material removal rate (MRR)  initiator   Effect of K2S2O8 on material removal rate in abrasive-free polishing of hard disk substrate 会议论文 MATERIAL DESIGN, PROCESSING AND APPLICATIONS, PARTS 1-4, 2013-03-30 作者:  Zhao, Rong[1];  Lei, Hong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 abrasive-free polishing  hard disk substrate  material removal rate  K2S2O8 initiator   Cu (II) as a catalyst for hydrogen peroxide system abrasive-free polishing on hard disk substrate 会议论文 MICRO-NANO TECHNOLOGY XIV, PTS 1-4, 2012-11-04 作者:  Wang, Zhijun[1];  Lei, Hong[2];  Zhang, Weitao[3];  Zhao, Rong[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Cu (II)  catalyst  abrasive-free polishing (AFP)  MRR   Effect of pH on hard disk substrate polishing in glycine-hydrogen peroxide system abrasive-free slurry 会议论文 MICRO-NANO TECHNOLOGY XIV, PTS 1-4, 2012-11-04 作者:  Chen Sisi[1];  Lei Hong[2];  Chen Ruling[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 abrasive free polishing (AFP)  glycine  hydrogen peroxide  hard disk substrate