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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2014     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Friction and Wear of Ti3SiC2-Ag/Inconel 718 Tribo-Pair Under a Hemisphere-on-Disk Contact 会议论文 第八届先进陶瓷国际研讨会, 中国重庆, 2013-11-4～2013-11-7 作者:  Hai WX(海万秀);  Lv JJ(吕晋军);  Meng JH(孟军虎) 收藏  |  浏览/下载：36/0  |  提交时间：2014/12/26 friction  wear  Ti3SiC2  Ag  Inconel 718   Effect of Mn (II) ion on abrasive-free polishing of hard disk substrate 会议论文 4th International Conference on Frontiers of Manufacturing Science and Measuring Technology, ICFMM 2014, 2014-06-19 作者:  Fang, Liang[1];  Lei, Hong[2];  Zhao, Rong[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 Preparation of porous alumina-g-polystyrene sulfonic acid abrasive and its chemical mechanical polishing behavior on hard disk substrate 期刊论文 MICROELECTRONIC ENGINEERING, 2014, 卷号: 116, 页码: 11-16 作者:  Huang, Liqin[1];  Wang, Zhijun[2];  Lei, Hong[3];  Chen, Ruling[4] 收藏  |  浏览/下载：12/0  |  提交时间：2019/04/30 Chemical mechanical polishing (CMP)  Porous alumina-g-polystyrene sulfonic acid abrasive  Hard disk substrate  Planarization   Effect of Benzoyl Peroxide/N, N-Dimethyl aniline initiating system on material removal rate in abrasive-free polishing of hard disk substrate 会议论文 International Conference on Planarization CMP Technology (ICPT) 作者:  Jiang, Ting[1];  Lei, Hong[2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/30 Influence of Zn (II) ion on abrasive-free polishing of hard disk substrate 期刊论文 THIN SOLID FILMS, 2014, 卷号: 562, 页码: 377-382 作者:  Lei, Hong[1];  Zhao, Rong[2];  Chen, Ruling[3] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Abrasive-free polishing  Hard disk substrate  Zinc (II) Ion  Material removal rate  Tribochemistry   Effect of AIBA on Abrasive-free Polishing of Hard Disk Substrate with Peroxyacetic Acid System Slurry 会议论文 Design, Manufacturing and Mechatronics, 2014-03-21 作者:  Ren, Xiao-yan[1];  Lei, Hong[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/30 AIBA  peroxyacetic acid  abrasive-free polishing (AFP)   Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2014, 卷号: 43, 页码: 4186-4192 作者:  Jiang, Ting[1];  Lei, Hong[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Abrasive-free chemical polishing  cumene hydroperoxide (CHP)  initiator  material removal rate  mechanism   Abrasive-free Chemical Polishing of Hard Disk Substrate with Benzoyl Peroxide-H2O2 Slurry 会议论文 Design, Manufacturing and Mechatronics, 2014-03-21 作者:  Jiang, Ting[1];  Lei, Hong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 benzoyl peroxide (BPO)  initiator  material removal rate (MRR)