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浏览/检索结果: 共21条，第1-10条 帮助 限定条件 发表日期：2006     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 高温,高湿环境中时效时Sn-Zn基无铅焊点的显微组织演化 期刊论文 中国有色金属学报, 2006, 卷号: 16, 页码: 1177-1183 作者:  Wei, Xi-Cheng[1];  Ju, Guo-Kui[2];  Sun, Peng[3];  Cheng, Zhao-Nian[4];  Shangguan, Dong-Kai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 SnZn基焊料  时效  湿度  显微组织  低周疲劳   Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/05/10 Residual stress in flip chip joining using anisotropic conductive adhesive 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Cheng, Zhaonian[1];  Cao, Liqiang[2];  Sun, Peng[3];  Liu, Johan[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint 期刊论文 Soldering and Surface Mount Technology, 2006, 卷号: 18, 页码: 4-11 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 finite element analysis  fatigue  joining materials  simulation  solders   Influence of intermittently etching on quality of CVD diamond thin films 期刊论文 Transactions of Nonferrous Metals Society of China (English Edition), 2006, 卷号: 16, 页码: s321-s323 作者:  Yang, Kan-Cheng[1];  Xia, Yi-Ben[2];  Wang, Lin-Jun[3];  Liu, Jian-Min[4];  Su, Qing-Feng[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 hot filament chemical vapor deposition  diamond film  intermittently etching   Effect of (Ba+Sr)/Ti ratio on dielectric and tunable properties of Ba0.6Sr0.4TiO3 thin film prepared by sol-gel method 期刊论文 Transactions of Nonferrous Metals Society of China (English Edition), 2006, 卷号: 16, 页码: s261-s265 作者:  Zhu, Wei-Cheng[1];  Peng, Dong-Wen[2];  Cheng, Jin-Rong[3];  Meng, Zhong-Yan[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Ba0.6Sr0.4TiO3 thin film  (Ba plus Sr)/Ti ratio  sol-gel method  dielectric properties   Study of interfacial reactions in Sn-3.5Ag-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 会议论文 ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings 作者:  Chen, Si[1];  Sun, Peng[2];  Liu, Johan[3];  Wei, Xicheng[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering 期刊论文 MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2006, 卷号: 135, 页码: 134-140 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 lead-free solder  ENIG surface finish  intermetallic compound (IMC)   High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni(P) metallization 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 425, 页码: 191-199 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 lead-free solder  electroless Ni(P)  interfacial reaction  inter-metallic compound (IMC)