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	Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint
	Sun, Peng[1]; Andersson, Cristina[2]; Wei, Xicheng[3]; Cheng, Zhaonian[4]; Shangguan, Dongkai[5]; Liu, Johan[6]
刊名	Soldering and Surface Mount Technology
	2006
卷号	18页码:4-11
关键词	finite element analysis fatigue joining materials simulation solders
ISSN号	09540911
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2391567
专题	上海大学
作者单位	[1]Key State Lab. for New Displays and System Integration , SMIT Center, Shanghai University, Shanghai, China |Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, G?teborg, Sweden [2]Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, G?teborg, Sweden [3]Key State Lab. for New Displays and System Integration , SMIT Center, Shanghai University, Shanghai, China |School of Materials Science and Engineering, Shanghai University [4]Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, G?teborg, Sweden |Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences [5]Flextronics International, San Jose, CA, United States |Shanghai University, China |Flextronics International |Corporate Technology Group |IEEE |SME [6]Key State Lab. for New Displays and System Integration , SMIT Center, Shanghai University, Shanghai, China |Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, G?teborg, Sweden |Department of Electronics Packaging, Chalmers University of Technology, Goteborg, Sweden |Division of Electronics Production |Board of Governors, IEEE CPMT Society Worldwide
推荐引用方式 GB/T 7714	Sun, Peng[1],Andersson, Cristina[2],Wei, Xicheng[3],et al. Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint[J]. Soldering and Surface Mount Technology,2006,18:4-11.
APA	Sun, Peng[1],Andersson, Cristina[2],Wei, Xicheng[3],Cheng, Zhaonian[4],Shangguan, Dongkai[5],&Liu, Johan[6].(2006).Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint.Soldering and Surface Mount Technology,18,4-11.
MLA	Sun, Peng[1],et al."Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint".Soldering and Surface Mount Technology 18(2006):4-11.

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