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	Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering
	Sun, Peng[1]; Andersson, Cristina[2]; Wei, Xicheng[3]; Cheng, Zhaonian[4]; Shangguan, Dongkai[5]; Liu, Johan[6]
刊名	MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
	2006
卷号	135页码:134-140
关键词	lead-free solder ENIG surface finish intermetallic compound (IMC)
ISSN号	0921-5107
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2393928
专题	上海大学
作者单位	1.Key State Lab for New Displays and System Integration , SMIT Center, Shanghai University, 200072 Shanghai, China 2.Flextronics International, San Jose, CA, United States 3.Department of Microtechnology and Nanoscience, SMIT Center, Chalmers University of Technology, 412-96 G?teborg, Sweden
推荐引用方式 GB/T 7714	Sun, Peng[1],Andersson, Cristina[2],Wei, Xicheng[3],et al. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering[J]. MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY,2006,135:134-140.
APA	Sun, Peng[1],Andersson, Cristina[2],Wei, Xicheng[3],Cheng, Zhaonian[4],Shangguan, Dongkai[5],&Liu, Johan[6].(2006).Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering.MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY,135,134-140.
MLA	Sun, Peng[1],et al."Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering".MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY 135(2006):134-140.

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