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浏览/检索结果: 共14条，第1-10条 帮助 限定条件 发表日期：2005     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Effective cryopreservation of human embryonic stem cells by programmed freezing 期刊论文 Conference proceedings : ... Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual Conference, 2005, 卷号: 1, 页码: 482-5 作者:  Yang Peng Fei[1];  Tsung Hsiao Chien[2];  Cheng Qi Kang[3];  Hua Tse Chao[4];  Wu Chun Fang[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 Effective cryopreservation of human embryonic stem cells by programmed freezing 期刊论文 Shi yan sheng wu xue bao, 2005, 卷号: 38, 页码: 247-56 作者:  Yang Peng Fei[1];  Tsung Hsiao Chien[2];  Cheng Qi Kang[3];  Hua Tse Chao[4];  Wu Chun Fang[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/05/10 Residual stress in flip chip joining using anisotropic conductive adhesive 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Cheng, Zhaonian[1];  Cao, Liqiang[2];  Sun, Peng[3];  Liu, Johan[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 residual stress  FE simulation  ACA  flip chip   Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/05/10 Residual stress in flip chip joining using anisotropic conductive adhesive 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Cheng, Zhaonian[1];  Cao, Liqiang[2];  Sun, Peng[3];  Liu, Johan[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 residual stress  FE simulation  ACA  flip chip   Coffin-Manson equation determination for Sn-Zn based lead-free solder joints 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Cheng, Zhaonian[3];  Lai, Zonghe[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10