| Coffin-Manson equation determination for Sn-Zn based lead-free solder joints | |
| Sun, Peng[1]; Andersson, Cristina[2]; Cheng, Zhaonian[3]; Lai, Zonghe[4]; Shangguan, Dongkai[5]; Liu, Johan[6] | |
| 2005 | |
| 会议名称 | Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) |
| 页码 | 342-347 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2399561 |
| 专题 | 上海大学 |
| 作者单位 | 1.Shanghai Univ, Sino Swedish Microsyst Integrat Technol, SMIT, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Sino Swedish Microsyst Integrat Technol, SMIT, Box 282,149 Yan Chang Rd, Shanghai 200072, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Sun, Peng[1],Andersson, Cristina[2],Cheng, Zhaonian[3],et al. Coffin-Manson equation determination for Sn-Zn based lead-free solder joints[C]. 见:Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05). |
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