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	Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure
	Sun, Peng[1]; Andersson, Cristina[2]; Wei, Xicheng[3]; Cheng, Zhaonian[4]; Shangguan, Dongkai[5]; Liu, Johan[6]
	2005
会议名称	Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
页码	197-202
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2401710
专题	上海大学
作者单位	1.Shanghai Univ, SMIT Ctr, Shanghai 200072, Peoples R China. 2.Shanghai Univ, SMIT Ctr, Box 282,149,Yan Chang Rd, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Sun, Peng[1],Andersson, Cristina[2],Wei, Xicheng[3],et al. Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure[C]. 见:Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05).

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