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	Residual stress in flip chip joining using anisotropic conductive adhesive
	Cheng, Zhaonian[1]; Cao, Liqiang[2]; Sun, Peng[3]; Liu, Johan[4]
	2005
会议名称	Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
关键词	residual stress FE simulation ACA flip chip
页码	139-144
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2399571
专题	上海大学
作者单位	1.Shanghai Univ, Sinoswedish Microsyst Integrat Technol, Shanghai 200072, Peoples R China. 2.Shanghai Univ, Sinoswedish Microsyst Integrat Technol, Box 282,149 Yan Chang Rd, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Cheng, Zhaonian[1],Cao, Liqiang[2],Sun, Peng[3],et al. Residual stress in flip chip joining using anisotropic conductive adhesive[C]. 见:Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05).

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