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Computational study of hydrogen bonding interaction between formamide and nitrosyl hydride 期刊论文
journal of molecular structure-theochem, 2006, 卷号: 778, 期号: 1-3, 页码: 49-53
作者:  Liu, Ying;  Liu, Wenqing;  Li, Haiyang;  Yang, Yong;  Cheng, Shuang
收藏  |  浏览/下载：15/0  |  提交时间：2010/11/30
Effect of nano-al2o3 surface treatment on the tribological performance of phenolic composite coating 期刊论文
Surface & coatings technology, 2006, 卷号: 201, 期号: 6, 页码: 3767-3774
作者:  Song, Hao-Jie;  Zhang, Zhao-Zhu;  Men, Xue-hu
收藏  |  浏览/下载：21/0  |  提交时间：2019/05/10
Integrated isotachophoretic reconcentration with zone electrophoresis separation on a quartz microchip for UV detection of flavonoids 期刊论文
electrophoresis, 2006, 卷号: 27, 期号: 24, 页码: 4904-4909
作者:  Ma, Bo;  Zhou, Xiaomian;  Wang, Gang;  Huang, Huaiqing;  Dai, Zhongpeng
收藏  |  浏览/下载：28/0  |  提交时间：2015/11/11
Preparation of solid acid SO42-/SiO2-TiO2 and its catalytic activity for esterification 期刊论文
chinese journal of catalysis, 2006, 卷号: 27, 期号: 11, 页码: 1033-1038
作者:  Zhang Qi;  Chang Jie;  Wang Tiejun;  Xu Ying
收藏  |  浏览/下载：11/0  |  提交时间：2016/10/27
Theoretical study of hydrogen bonding interaction in nitroxyl (HNO) dimer: Interrelationship of the two N-H center dot center dot center dot O blue-shifting hydrogen bonds 期刊论文
journal of physical chemistry a, 2006, 卷号: 110, 期号: 41, 页码: 11760-11764
作者:  Liu, Ying;  Liu, Wenqing;  Li, Haiyang;  Liu, Jianguo;  Yang, Yong
收藏  |  浏览/下载：13/0  |  提交时间：2015/11/11
An investigation into fire protection and water resistance of intumescent nano-coatings 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2006, 卷号: 201, 期号: 3-4, 页码: 1528-1535
作者:  Wang, Zhenyu;  Han, Enhou;  Ke, Wei
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02
Variations in Si-H bonding modes and a-Si:H growth by hot filament assisted microwave electron synchrotron resonance chemical vapor deposition 期刊论文
Zhenkong Kexue yu Jishu Xuebao/Journal of Vacuum Science and Technology, 2006, 卷号: 26, 期号: SUPPL., 页码: 67-70
作者:  Zhang, Wenli;  Chen, Guanghua;  He, Bin;  Zhu, Xiuhong;  Ma, Zhanjie
收藏  |  浏览/下载：2/0  |  提交时间：2016/10/21
Research and application of copper bonding wire in electronic packaging 期刊论文
Zhuzao Jishu/Foundry Technology, 2006, 卷号: 27, 期号: 9, 页码: 971-974
作者:  Ding, Yu-Tian;  Cao, Jun;  Xu, Guang-Ji;  Kou, Sheng-Zhong;  Hu, Yong
收藏  |  浏览/下载：17/0  |  提交时间：2022/02/18
Strain analysis of inp/ingaasp wafer bonded on si by x-ray double crystalline diffraction 期刊论文
Materials science and engineering b-solid state materials for advanced technology, 2006, 卷号: 133, 期号: 1-3, 页码: 117-123
作者:  Zhao, Hong-Quan;  Yu, Li-Juan;  Huang, Yong-Zhen;  Wang, Yu-Tian
收藏  |  浏览/下载：21/0  |  提交时间：2019/05/12
Thymine and adenine derivatives with pyrene, tetrathiafulvalene and nitronyl nitroxide units: synthesis and formation of ensembles sensing thymine and adenine molecules 期刊论文
Chinese science bulletin, 2006, 卷号: 51, 期号: 16, 页码: 1947-1954
作者:  Wang Zhuo;  Yu Yanxin;  Zhang Deqing;  Zhu Daoben
收藏  |  浏览/下载：19/0  |  提交时间：2019/05/10

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