Research and application of copper bonding wire in electronic packaging

CORC > 兰州理工大学 > 兰州理工大学 > 省部共建有色金属先进加工与再利用国家重点实验室

	Research and application of copper bonding wire in electronic packaging
	Ding, Yu-Tian; Cao, Jun; Xu, Guang-Ji; Kou, Sheng-Zhong; Hu, Yong
刊名	Zhuzao Jishu/Foundry Technology
	2006-09-01
卷号	27 期号:9 页码:971-974
ISSN号	10008365
英文摘要	The limitation of the conventional Au and Al-1%Si bonding wire in electronic packaging, and the excellent properties of copper bonding wire were reviewed. Cu bonding wire instead of gold bonding wire and aluminum bonding wire can shorten the bonding space, and improve the CMOS chip frequency and reliability. Moreover, the advantages of single crystal copper as bonding wire were discussed. The comparison result of bonding properties shows that copper bonding wire has excellent properties in electronic packaging.
语种	中文
出版者	Science Press, Beijing, China
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/151502]
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
作者单位	State Key Laboratory of Gansu Advanced Nonferrous Materials, Lanzhou University of Technology, Lanzhou 730050, China
推荐引用方式 GB/T 7714	Ding, Yu-Tian,Cao, Jun,Xu, Guang-Ji,et al. Research and application of copper bonding wire in electronic packaging[J]. Zhuzao Jishu/Foundry Technology,2006,27(9):971-974.
APA	Ding, Yu-Tian,Cao, Jun,Xu, Guang-Ji,Kou, Sheng-Zhong,&Hu, Yong.(2006).Research and application of copper bonding wire in electronic packaging.Zhuzao Jishu/Foundry Technology,27(9),971-974.
MLA	Ding, Yu-Tian,et al."Research and application of copper bonding wire in electronic packaging".Zhuzao Jishu/Foundry Technology 27.9(2006):971-974.