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Communication and Control through Words and Power 期刊论文
Advanced Materials Research, 2011, 卷号: Vol.403-408, 页码: 982-993
作者:  RejiM.Issac
收藏  |  浏览/下载:2/0  |  提交时间:2020/01/04
Information Management Gaps for Board FABRICATION and ASSEMBLY. 期刊论文
Circuits Assembly, 2009, 卷号: Vol.20 No.9, 页码: 29-31
作者:  SIMMON,ERIC
收藏  |  浏览/下载:1/0  |  提交时间:2020/01/13
Projects And Partners Move OLEDs Closer To The Spotlight. 期刊论文
Electronic design, 2008, 卷号: Vol.56 No.15, 页码: 71-72
作者:  Dirjish,Matmat.dirijish@penton.com
收藏  |  浏览/下载:3/0  |  提交时间:2020/01/13
Rotating LED Array Emulates Marquee-Type Display. 期刊论文
Electronic design, 2008, 卷号: Vol.56 No.24, 页码: 56-57
作者:  Myer,Dennis
收藏  |  浏览/下载:10/0  |  提交时间:2020/01/13
Smart As A Brick--A New Approach Rejuvenates IBA. 期刊论文
Electronic design, 2008, 卷号: Vol.56 No.15, 页码: 23-24
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收藏  |  浏览/下载:2/0  |  提交时间:2020/01/13
Boolean Logic and Alternative Information-Processing Devices. 期刊论文
Computer, 2008, 卷号: Vol.41 No.5, 页码: 38-46
作者:  Brewer,JoeE.;  Hutchby,JamesA.;  Cavin,Ralph;  Zhirnov,Victor;  Bourianoff,George
收藏  |  浏览/下载:1/0  |  提交时间:2020/01/13
Millions and billions. 期刊论文
EDN, 2008, 卷号: vol.50 No.17, 页码: 36
作者:  Johnson,Howard
收藏  |  浏览/下载:1/0  |  提交时间:2020/01/13
As SOCs grow, instruments move on-chip. 期刊论文
Test and Measurement World, 2008, 卷号: Vol.28 No.3, 页码: 23
作者:  Wilson,Ron
收藏  |  浏览/下载:4/0  |  提交时间:2020/01/13
MEMS And 3D Packaging. 期刊论文
Electronic design, 2008, 卷号: Vol.56 No.15, 页码: 50
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收藏  |  浏览/下载:1/0  |  提交时间:2020/01/13
Shrinking ICs Need High Density In A Package Deal. 期刊论文
Electronic design, 2008, 卷号: Vol.56 No.15, 页码: 42-50
作者:  Allan,Roger
收藏  |  浏览/下载:5/0  |  提交时间:2020/01/13


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