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Enhanced thermoelectric performance of Te-doped skutterudite with nano-micro-porous architecture 期刊论文
Scripta Materialia, 2019, 卷号: 159, 页码: 68-71
作者:  Yang, Houjiang;  Wen, Pengfei*;  Zhou, Xilong;  Li, Yao;  Duan, Bo
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/04
Dramatically reduced lattice thermal conductivity of Mg 2 Si thermoelectric material from nanotwinning 期刊论文
Acta Materialia, 2019, 卷号: 169, 页码: 9-14
作者:  Li, Guodong;  He, Jiangang;  An, Qi;  Morozov, Sergey I.;  Hao, Shigiang
收藏  |  浏览/下载：21/0  |  提交时间：2019/12/04
Grain Boundaries Softening Thermoelectric Oxide BiCuSeO 期刊论文
ACS Applied Materials and Interfaces, 2018, 卷号: 10, 期号: 7, 页码: 6772-6777
作者:  Li, Guodong*;  Hao, Shiqiang;  Morozov, Sergey I.;  Zhai, Pengcheng;  Zhang, Qingjie*
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04
Using a Novel Supramolecular Gel Cryopreservation System in Microchannel to Minimize the Cell Injury 期刊论文
Langmuir, 2018, 卷号: 34, 期号: 17, 页码: 5088-5096
作者:  Lan, Dongxu;  Chen, Xi;  Li, Pengcheng;  Zou, Wei;  Wu, Lili
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/04
Ductile deformation mechanism in semiconductor alpha-Ag2S 期刊论文
npj Computational Materials, 2018, 卷号: 4, 期号: 1, 页码: 44-npj Computational Materialsvolume 4, Article number: 44
作者:  Li, Guodong*;  An, Qi;  Morozov, Sergey I.;  Duan, Bo;  Goddard, William A., III
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04
Duration of Thermal Stability and Mechanical Properties of Mg2Si/Cu Thermoelectric Joints 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 5, 页码: 2591-2599
作者:  Cai, Lanlan;  Li, Peng*;  Wang, Pei;  Luo, Qi;  Zhai, Pengcheng
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/04
Determining ideal strength and failure mechanism of thermoelectric CuInTe2 through quantum mechanics 期刊论文
Journal of Materials Chemistry A, 2018, 卷号: 6, 期号: 25, 页码: 11743-11750
作者:  Li, Guodong*;  An, Qi;  Morozov, Sergey I.;  Duan, Bo;  Zhai, Pengcheng
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/04
Multi-Mode Iot Gateway Design and Implemention 会议论文
2nd International Conference on Mechanical, Electronic, Control and Automation Engineering (MECAE), Qingdao, PEOPLES R CHINA, MAR 30-31, 2018
作者:  Sun, Pengcheng*;  Li, Dong
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/04
First-Principles Study on the Tensile Properties and Failure Mechanism of the CoSb3/Ti Interface 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 6, 页码: 3210-3217
作者:  She, Wuchang;  Liu, Qiwen;  Mei, Hai;  Zhai, Pengcheng;  Li, Jun
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/04
Beneficial Effect of S-Filling on Thermoelectric Properties of SxCo4Sb11.2Te0.8 Skutterudite 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 6, 页码: 3061-3066
作者:  Wang, Hongtao;  Duan, Bo*;  Bai, Guanghui;  Li, Jialiang;  Yu, Yue
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/04

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