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	Duration of Thermal Stability and Mechanical Properties of Mg2Si/Cu Thermoelectric Joints
	Cai, Lanlan; Li, Peng*; Wang, Pei; Luo, Qi; Zhai, Pengcheng; Zhang, Qingjie
刊名	Journal of Electronic Materials
	2018
卷号	47期号:5页码:2591-2599
关键词	Mg2Si-based thermoelectric materials Cu electrode thermoelectric joints contact properties thermal stability
ISSN号	0361-5235
DOI	10.1007/s11664-018-6091-2
URL标识	查看原文
WOS记录号	WOS:000428819300009;EI:20181404985306
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3388492
专题	武汉理工大学
作者单位	1.[Luo, Qi 2.Cai, Lanlan 3.Li, Peng 4.Wang, Pei] Wuhan Univ Technol, Sch Mech & Elect Engn, Wuhan 430070, Hubei, Peoples R China.
推荐引用方式 GB/T 7714	Cai, Lanlan,Li, Peng*,Wang, Pei,et al. Duration of Thermal Stability and Mechanical Properties of Mg2Si/Cu Thermoelectric Joints[J]. Journal of Electronic Materials,2018,47(5):2591-2599.
APA	Cai, Lanlan,Li, Peng*,Wang, Pei,Luo, Qi,Zhai, Pengcheng,&Zhang, Qingjie.(2018).Duration of Thermal Stability and Mechanical Properties of Mg2Si/Cu Thermoelectric Joints.Journal of Electronic Materials,47(5),2591-2599.
MLA	Cai, Lanlan,et al."Duration of Thermal Stability and Mechanical Properties of Mg2Si/Cu Thermoelectric Joints".Journal of Electronic Materials 47.5(2018):2591-2599.

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