| Beneficial Effect of S-Filling on Thermoelectric Properties of SxCo4Sb11.2Te0.8 Skutterudite | |
| Wang, Hongtao; Duan, Bo*; Bai, Guanghui; Li, Jialiang; Yu, Yue; Yang, Houjiang; Chen, Gang; Zhai, Pengcheng* | |
| 刊名 | Journal of Electronic Materials
 |
| 2018 | |
| 卷号 | 47期号:6页码:3061-3066 |
| 关键词 | Skutterudite S-filling thermoelectric properties charge compensation |
| ISSN号 | 0361-5235 |
| DOI | 10.1007/s11664-017-5891-0 |
| 会议名称 | 36th Annual International Conference on Thermoelectrics (ICT) |
| URL标识 | 查看原文 |
| 会议地点 | Pasadena, CA |
| 会议日期 | JUL 31-AUG 03, 2017 |
| WOS记录号 | WOS:000431920400001;EI:20174604394239 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3373093 |
| 专题 | 武汉理工大学 |
| 作者单位 | 1.[Wang, Hongtao 2.Yu, Yue 3.Chen, Gang 4.Li, Jialiang 5.Zhai, Pengcheng 6.Duan, Bo 7.Yang, Houjiang] Wuhan Univ Technol, Hubei Key Lab Theory & Applicat Adv Mat Mech, Wuhan 430070, Hubei, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Hongtao,Duan, Bo*,Bai, Guanghui,et al. Beneficial Effect of S-Filling on Thermoelectric Properties of SxCo4Sb11.2Te0.8 Skutterudite[J]. Journal of Electronic Materials,2018,47(6):3061-3066. |
| APA | Wang, Hongtao.,Duan, Bo*.,Bai, Guanghui.,Li, Jialiang.,Yu, Yue.,...&Zhai, Pengcheng*.(2018).Beneficial Effect of S-Filling on Thermoelectric Properties of SxCo4Sb11.2Te0.8 Skutterudite.Journal of Electronic Materials,47(6),3061-3066. |
| MLA | Wang, Hongtao,et al."Beneficial Effect of S-Filling on Thermoelectric Properties of SxCo4Sb11.2Te0.8 Skutterudite".Journal of Electronic Materials 47.6(2018):3061-3066. |
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