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	Grain Boundaries Softening Thermoelectric Oxide BiCuSeO
	Li, Guodong*; Hao, Shiqiang; Morozov, Sergey I.; Zhai, Pengcheng; Zhang, Qingjie*; Goddard, William A., III; Snyder, G. Jeffrey*
刊名	ACS Applied Materials and Interfaces
	2018
卷号	10期号:7页码:6772-6777
关键词	atomistic modeling grain boundary softening micromechanics thermoelectric oxide BiCuSeO
ISSN号	1944-8244
DOI	10.1021/acsami.7b19501
URL标识	查看原文
WOS记录号	WOS:000426143900079
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3382604
专题	武汉理工大学
作者单位	1.[Zhang, Qingjie 2.Li, Guodong 3.Zhai, Pengcheng] Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Hubei, Peoples R China.
推荐引用方式 GB/T 7714	Li, Guodong*,Hao, Shiqiang,Morozov, Sergey I.,et al. Grain Boundaries Softening Thermoelectric Oxide BiCuSeO[J]. ACS Applied Materials and Interfaces,2018,10(7):6772-6777.
APA	Li, Guodong*.,Hao, Shiqiang.,Morozov, Sergey I..,Zhai, Pengcheng.,Zhang, Qingjie*.,...&Snyder, G. Jeffrey*.(2018).Grain Boundaries Softening Thermoelectric Oxide BiCuSeO.ACS Applied Materials and Interfaces,10(7),6772-6777.
MLA	Li, Guodong*,et al."Grain Boundaries Softening Thermoelectric Oxide BiCuSeO".ACS Applied Materials and Interfaces 10.7(2018):6772-6777.

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