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科研机构
华南理工大学 [18]
内容类型
会议 [18]
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Multi-variable Time Series Forecasting for Thermal Load of Air-conditioning system on SVR (CPCI-S收录)
会议
作者:
Zhou Xuan[1,2]
;
Liu Qing-dian[1,2]
;
Liu Guo-qiang[1,2]
;
Yan Jun-wei[1,2]
;
Yang Jian-cheng[1,2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
thermal load of air conditioning system
Support Vector Regression
multi-variable time series forecasting method
Particle Swarm Optimization (PSO) algorithm
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Diagnosis and Treatment of Pure Red Cell Aplasisa Caused By Human Parvovirus B19 After Liver Transplantation: Report of One Case and Literatu (CPCI-S收录)
会议
作者:
Ju, Weiqiang[1]
;
Ren, Qingqi[1]
;
Chen, Maogen[1]
;
Zhou, Jian[1]
;
Yang, Anli[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Tuning electronic properties of bilayer boron-phosphide by stacking order and electric field: A first principles investigation (EI收录)
会议
Wuhan, China,
作者:
Tan, Chunjian[1]
;
Zhou, Qiang[1]
;
Chen, Xianping[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Chip scale packages
Electric fields
Electronic properties
Electronic structure
Electronics packaging
Monolayers
Sneak-path Based Test for 3D Stacked One-Transistor-N-RRAM Array (CPCI-S收录)
会议
作者:
Zhang, Qiang[1]
;
Cui, Xiaole[1]
;
Xu, Xiaoyan[1]
;
Wang, Xin'an[1]
;
Ma, Zhi[2]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
RRAM
test technique
sneak-paths
resistance variation
Service capacity planning of the community hospital under the hierarchical medical system (EI收录)
会议
Kunming, China,
作者:
Zhou, Yulin[1]
;
Zhou, Wenhui[1]
;
Zhang, Shuo[1]
;
Wan, Qiang[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Costs
Game theory
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization (CPCI-S收录)
会议
作者:
Zhou, Min-Bo[1,2]
;
Feng, Jian-Qiang[1,2]
;
Yue, Wu[3]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/11
interfacial reaction
intermetallic compound
undercooling dwelling
low temperature soldering
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