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浏览/检索结果: 共50条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The design and implementation of the crawler-Inar (CPCI-S收录) 会议论文 PROCEEDINGS OF 2006 INTERNATIONAL CONFERENCE ON MACHINE LEARNING AND CYBERNETICS, VOLS 1-7 作者:  Ding, Yu-Xin[1];  Wang, Xiao-Long[1];  Lin, Le-Bin[1];  Zhang, Qi[1];  Wu, Yong-Hui[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/18 crawler  single thread  asynchronous I/O  web   IMPACTS OF SUBSTRATE HEATING SCHEMES ON CHARACTERISTICS OF AMORPHOUS INDIUM-GALLIUM-ZINC-OXIDE (a-IGZO) TFTS FABRICATED ON FLEXIBLE SUBSTRATE (CPCI-S收录) 会议论文 2014 12TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) 作者:  Xiao, Xiang[1];  Xie, Lei[1];  Shao, Yang[1];  He, Xin[2];  Zhang, Peng[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 Effect of Activators and Surfactants in Halogen-free Fluxes on Wettability of Sn-0.7Cu-0.05Ni Solder on Cu Substrate (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Li, Chang-Zheng[1];  Yan, Mo-Yang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 activator  surfactant  wettability  halogen-free flux  Sn-0.7Cu-0.05Ni solder   Microstructural Evolution and Mechanical Behavior of Line-type Ni/Sn3.0Ag0.5Cu/Ni Interconnects with a Small Thickness during Isothermal Agin (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid Isothermal Aging at and above the Solder's Melting Tem (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Zhou, Min-Bo[1];  Zeng, Jing-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Li, Chang-Zheng[1];  Yan, Mo-Yang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Electronics packaging  Nickel  Soldering  Soldering alloys  Substrates  Surface active agents  Wetting   Influence of Pre-existing Void in the Solder Joint on Electromigration Behavior of Cu/Sn58Bi/Cu Joints (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Yue, Wu[1];  Zhou, Min-Bo[1];  Qin, Hong-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Electromigraiton  Pre-existion void  Cu/Sn58Bi/Cu solder joint  Inhibittion effect  Crack   F-18-FDG Uptake Identify Vulnerable Carotid Plaque on PET/CT in a Swine Model (CPCI-S收录) 会议论文 STROKE 作者:  Shi, Zhong-Song[1];  Wang, Jin-Shan[1];  Zhang, Xiang-Song[2];  Jiang, Xiao-Bing[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Arteriosclerosis  Carotid arteries  Vulnerable plaque  Positron emission tomography   Influence of Soldering Temperature and Dwelling Time on Morphological Evolution of CU6Sn5 Intermetallic Compound at the Sn-3.0Ag-0.5Cu/Cu Int (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Xu, Guang-Sui[1];  Zeng, Jing-Bo[1];  Zhou, Min-Bo[1];  Cao, Shan-Shan[1];  Ma, Xiao[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 High Performance Multilevel Data Storage in TaTiN/HfOx/Pt Based RRAM Using Bipolar and Unipolar Combined Switching Mode (CPCI-S收录) 会议论文 2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) 作者:  Chen, Bing[1,2];  Deng, Ye Xin[2];  Gao, Bin[2];  Liu, Rui[2];  Ma, Long[1,2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15